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Technology

Solder paste

Versatile, stable, low-voiding solder paste

Indium Corporation will feature its void-reducing Indium8.9HF solder paste to help customers “Avoid the Void” at SMT Hybrid Packaging May 16–18, in Nuremberg, Germany.

Air technology

Extraction and filtration system concept

ULT AG, vendor of air technology systems, will introduce a new extraction and filtration device generation at SMT Hybrid Packaging trade show in...

Volume production

Pick-and-place systems and features

Hanwha Techwin Automation Americas, Inc., formerly Samsung C&T Automation, today announced new PLUS features on its next-generation SM Series...

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Depanelers

Easy test handler and depanelers

IPTE is represented with its Easy Test Handler ETH and the depanelers EasyRouter, TopRouter and FlexRouter II at the German Pavilion (Stand: 1C05) at NEPCON...

3D inspection

Networked 3D inspection systems

For solder paste inspection (SPI), automatic optical inspection (AOI) and automatic and manual X-ray inspection (AXI/MXI) technologies, DELTEC Automotive GmbH...

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Traceability

Process control

Metcal’s CV-5200 Connection Validation Soldering Station provides real-time closed loop feedback on intermetallic compound formation.

Surface mounter

Mounter with fast placement

Yamaha IM America, in partnership with Trans-Tec Worldwide, will exhibit dynamic new SMT assembly technology in booth #2317 at IPC/APEX 2017 next week.

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