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solder paste inspection
Pioneering 3D measurement leader provides a complete 3D inspection solution with integration

Next higher level of inspection

Koh Young Technology, the leading supplier in the SMT inspection market, now offers a total 3D inspection and process optimization solution.

Reinventing the spring-loaded probe pin

Fully automated, high volume process

For decades the spring-loaded probe aka pogo-style pin has delivered excellent mechanical and electrical performance in a highly compliant contact.

Using PC-based machine control or traditional PLC in automation systems?

Weighing the multitude of application options

Over time, PC-based machine control has encroached upon, and ultimately gained dominance over traditional, reliable PLC controllers.

Cable and harness manufacturing with diagnostics

Identifying intermittent failure

Cables in motion experience fatigue causing complete or intermittent failures whether or not that motion is constant.

Flying probe solution based on successful customer experience

Testing boards for the sky

Flying Probes are currently used to test boards both on commercial and military products for prototype verification, production or depot repair. Costly, high...

Speed/throughput, accuracy specifics and cycle time as SMT paste printing challenges

Terms that need a better and truer understanding

Current trends in the production of mobile consumer electronics and automotive products are driving the SMT stencil printing process to achieve higher...

Reed relays – A near perfect switching element

Ease of use and improvements

A reed relay, having a simple metallic path, will give a long and reliable life if correctly used. Despite competition from other technologies, ease of use and...

Probe manufacturing technology addresses semiconductor test challenges

Miniaturisation and performance in probes

Semiconductor probe pins are approaching a crunch point. Silicon geometries are getting ever finer, and packaging density has been increasing for SMT ICs...

Advantages of Bismuth-based alloys for low-temperature Pb-free soldering and rework

Avoiding thermal damage to components and susbtrates

The increased functionality of personal electronic devices has driven the need for miniaturization of components. This is happening simultaneously as the...

Reliability testing of flexible electronics, in situ

Quantitative information advances device design

Researcher Dr Dario Gastaldi has found confocal laser scanning microscopy yields many advantages in his investigations into flexible electronics. Through in...


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