Combining jetting and placement All-in-one jetting/placement system at SMTA Capital expo - EPP Europe

Combining jetting and placement

All-in-one jetting/placement system at SMTA Capital expo

essemtec_bild.jpg
The FOX2 machine combines jetting of solder paste or glue and placement, all in one. Source: Essemtec
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Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announced plans to exhibit at the SMTA Capital Show, scheduled to take place on Aug. 24, 2017. The company will demonstrate the FOX2 that combines jetting of solder paste or glue and placement in a single machine.

In many electronics production plants, new product introductions and prototype runs are still considered special processes. As a result, certain aspects are rushed during the ramp-up, and ongoing production runs can suffer from excessively long and expensive interruptions. Using the company‘s all-in-one solutions, consistent, efficient, and reliable NPI processes are established.

FOX2 has a machine footprint of just 1m2 and can accept PCB sizes up to 16 x 12 “. Larger PCB machines are also available. Components with sizes from 01005 up to 1.3 x 3.1 “ are placed. The machine achieves 10,800 cph (IPC9850) with the release of ePLACE 23 and still provides 50 µm accuracy, 3 sigma with a two nozzle head.

www.essemtec-usa.com

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