Exhibiting CCGA, solder joint reliability solutions

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Solder joint

Exhibiting CCGA, solder joint reliability solutions

solder joint
TopLine CCGA non-collapsible solder column. Source: TopLine
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TopLine will exhibit for the 20th straight year at SMT Hybrid Packaging Exhibition in Nuremberg, Germany, May 16 –18, 2017.

Featured products will include CCGA – Column Grid Arrays and daisy chain BGA test vehicles. CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs), and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
The SMT show, held at Exhibition Centre Nuremberg, Messezentrum, 90471 Nuremberg, Germany is a prestigious professional trade platform and exhibition of SMT (Surface Mount Technology) and hybrid semiconductors and semiconductor packaging. The show brings together more than 420 exhibitors from the electronics manufacturing industry around the globe with innovative equipment, materials, and system integration solutions.
The company has been active in promoting its products in the European market for 28 years.
SMT Hybrid Packaging, Booth A4-120
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