Future packaging line at SMT

Laser

Future packaging line at SMT

packaging line
The future packaging line. Source: IPTE
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A subset of IPTE’s capabilities will be shown in the Future Packaging line, at the SMT Hybrid Packaging show at the Messe in Nuremberg, Germany. Besides all connection conveyor between the various brands of equipment, they will also show a laser marker FlexMarker II and a test handler ETH Boardhandler.
The FlexMarker II can be equipped with a selection of lasers matching your requirements. The laser is positioned in an XY table allowing marking on a wide area. An optional fast flip unit can also be used to enable marking on the other side as well.
The ETH is the economical test handler within the company’s portfolio and is ideally suited for flashing/functional/small ICT applications. An optional bypass transport within the 500 mm footprint can be used to enable parallel testing in a serial line. The ETH can also be equipped with an optional Cage of Faraday for RF testing.
The family of boardhandlers also include heavy-duty handler (up to 15,000 N), as well as, real in-line hot test (125 ºC) handler.
IPTE’s Easyline conveying equipment can be easily integrated in your production lines and offer smooth PCB transport between processes. EasyLine modules are available in Small (300 mm), Medium (500 mm) or Large size (600 mm) segments for both conventional PCBs as Hybrid ceramic panels.
SMT Hybrid Packaging, Booth 5-434
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Save the date! 17. May 2018

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