Indium Corporation has launched 10.1HF solder paste, specifically formulated to achieve ultra-low voiding in bottom termination component (BTC) assemblies and improve reliability by minimizing voiding and maximizing ECM and head-in-pillow performance.
This solder paste is an air reflow, no-clean, halogen-free, Pb-free with a flux chemistry engineered to improve reliability with:
- High ECM performance under low standoff components, RF shields without proper ventilation, and components in low-clearance cavities
- Solder beading minimization
- Very low bridging, slump, and solder balling
- Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
- High print transfer efficiency with low variation
It is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249–2–21, test method EN 14582.
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