CyberOptics debuts its latest inspection system, the SE500 100 percent 3-D solder paste inspection system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed without compromising measurement accuracy and repeatability. Building on the company’s reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the system can inspect pad sizes down to 01005 component size (150 x 150 µm) while keep- ing up with ever-increasing line speeds. The product suite consists of two models to accommodate varying panel sizes. While the system is capable of transporting panels from 50 x 50 mm up to 510 x 510 mm, the SE500-X can transport panels from 100 x 100 mm up to 810 x 610 mm. Standard features for both models include: automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using sensor, and Process Tracker SPC charts with alarm capability. The innovative QX500 AOI system is designed with a unique image acquisition solution – Strobed Inspection Module (SIM), bringing forth yet another industry-leading, high-speed inspection solution matched with exceptional defect coverage and an extremely low false failure rate. The introduction of strobed white lighting in the system makes it the only AOI system to provide ‘on-the-fly’ area-scanning inspection at an incredible 200 cm²/sec, setting it apart from other conventional AOI systems.