North America, Inc., a worldwide leading supplier of complete solutions for soldering processes and automated production lines, will highlight a full line of selective soldering and wave soldering systems in Booth #2309 at the IPC APEX Expo, scheduled to take place Feb. 14 – 16, 2017 at the San Diego Convention Center.
Electronics production faces new manufacturing challenges more and more frequently. Besides high quality requirements at low production costs, there is also an increasing number of product variants and the need for flexible reactions to fluctuation in demand. The soldering systems offer the optimal solution when both matters, high soldering quality, and outstanding flexibility.
The selective soldering system, GoSelective-LS, is specifically designed for stand-alone production of small and medium sized volumes and it scores highly with its very compact design. To ensure an ergonomic workflow and the shortest cycle times, the GoSelective-LS is equipped with a loading and unloading station for carriers up to 20”x20”. Here, boards can be assembled in one carrier while a second carrier is being processed in the machine. All process steps are completely automated. The machine features a precise axis system that positions the DropJet Flux dispenser, Preheat unit, and Soldering unit during the process. Depending on the requirements, the Electro-Magnetic Soldering unit may be used for flexible mini-wave soldering processes, or can be equipped with a multi-nozzle tool for dip soldering with short cycle times.
The company also will display the selective soldering system, SelectLine-C, that features an outstanding modular design and innovative technical details, thus ensuring clear cost benefits. The SelectLine-C machine concept incorporates fluxerstation, various preheat stations, and several soldering stations that are equipped to meet different manufacturing requirements. A particular highlight for the soldering area is the Synchro software feature to double production volume without major investments. In addition, a brush station used to remove any residues after the soldering process and an AOI station that immediately inspects solder joints can be integrated into the machine. The different machine modules can be configured to an individual manufacturing line. The machine can of course be upgraded with additional modules at any time to grow with the production requirements.
All of the selective soldering systems feature 100 percent process control, with fiducial recognition, flux quantity control, wave height control, process visualization, McServer, and many more value-added features. In doing so, they provide uncompromising superior accuracy and soldering quality. The automatic ultrasonic nozzle cleaning function guarantees reliable processes and maximum machine availability.
The company also will introduce new and innovative concepts in the field of wave soldering. As an alternative to the conventional solvent-based fluxing process, the company developed a new plasma process to deposit flux powder at the printed circuit board surface. Due to reduced residues, product Quality, and downtime of the machine can be improved, thus ensuring remarkable cost reduction.
Preheating of PCBs, especially for the increasing share of power electronics, requires a high energy density. This can be implemented efficiently by using new infrared emitters that offer extremely good heat transfer. The fast response of these emitters, an exact PCB monitoring system and a newly developed software allow that the emitters are only activated in areas where a PCB is located.
Finally, the customers profit from complete solutions that include customized automation of production lines for board handling and material management. Work places for assembly of electronic components, buffer and paternoster stations, turn stations, automatic lifts,and of course, the completely automated conveyor units in between are only a few examples.
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