Mounter for faster, more efficient electronics assembly

Surface mounter

Mounter for faster, more efficient electronics assembly

surface mounter
Ultra high-speed modular Z:TA-R YSM40R. Source: Yamaha Motor IM Europe
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Yamaha Motor IM Europe is to showcase the YSM40R Ultra-High-Speed Modular surface mounter as part of its full line solution at SMT Hybrid Packaging 2017 in Nuremberg May 16–18.
The YSM40R’s 200,000 cph placement capability and area-efficient 1 m-wide outline frees OEMs and contract assemblers to increase capacity and maximize use of available space. Visitors can see for themselves the technical advances in head, feeder, camera and nozzle technologies – including high-speed motion and simultaneous multi-component visual recognition – that enable such extremely high productivity per square meter.
Visitors to Nuremberg can see further powerful options for configuring fast and flexible SMT lines, including the High-Efficiency Modular YSM20 2-beam mounter and iPulse S10 and M20 hybrid mounters. The YSM20 features innovations including smart component-shape recognition and accuracy compensation. With the company’s efficient “1-head solution” concept and special design features for fast changeovers, YSM20 delivers market-leading productivity in the 90,000 cph class. The YSM20 family also includes the wide-body YSM20W; a flexible, efficient inline mounter for emerging opportunities in markets such as LED lighting, medical, cloud and automotive that demand precision placement on large or heavy boards.
The company’s S10 and M20 hybrid mounters give the option of built-in adhesive dispensing, and have capacity for 90 or 180 feeders respectively. They can place components from tiny chips and CSPs to larger ICs and connectors on long boards such as large LED assemblies. The M20 accepts boards up to 1.48 meters long, allows multiple head choices to balance speed and precision, and can place odd-form components. Options and upgrades for the S10 3D mounter enable component placement on contoured or tilted boards, and Molded Interconnect Device (MID) assembly.
Extra productivity, from screen print to inspection
In addition, the company will present advanced solutions, spanning high-speed high-resolution screen-printing and visual inspection, and powerful software products that are affordable, easy to use, and take advantage of its unique inter-machine data structures. These empower operators to manage their activities for optimum efficiency, and provide deeper insights into equipment health and production status.
The high-performance, compact equipment theme continues with the YCP10 screen printer. This features the company’s original swing-single-squeegee head with variable angle for ultimate efficiency and perfect paste transfer. Further features that boost productivity include easy-to-use graphical alignment, automatic stencil cleaning, and options, such as in-printer inspection and solder-roll measurement.
Booth displays will also express how recent additions to the YSi-V AOI family greatly expand access to high-accuracy 3D optical inspection augmented by laser component-height and coplanarity checking. 5M pixel and 12M pixel configurations with multi-angle/multi-wavelength inspection, and the high-speed TypeHS variants that incorporate additional technologies to accelerate throughput, provide options to suit many budgets.
To help customers secure the maximum performance all the way along the line, the company continues to refine and extend its line-management and productivity software products. These range from simple smartphone/tablet apps that alert supervisors wherever they are in the event of an event needing attention, to powerful tools for optimizing setup, real-time monitoring and management, and traceability. iProDB stores and analyses inspection results to assess the status of equipment such as printer and mounters in the line, and helps identify opportunities to raise quality through process optimization and improvements to product design.
The company’s full-line solutions portfolio comprises printers, dispensers, mounters, odd-form assemblers, optical and X-ray 3D inspection systems, advanced robotic assemblers, programming and monitoring software. Users can also benefit from a large selection of productivity boosters such as self-calibrating auto-load feeders and stacked-stick feeders, in addition to software tools and mobile apps.
SMT Hybrid Packaging, Booth 4–321
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