Unveiling of the iineo+ placement platform

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Pick and place

Unveiling of the iineo+ placement platform

placement platform
The new iineo+ placement platform launching at SMT Nuremberg. Source: Europlacer Deutschland GmbH
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Europlacer announces the European launch of its newest pick & place machine, the iineo+ platform, positioned at the top of its product range. Based on the company’s iineo machine, the new iineo+ platform includes an integrated component electrical tester, a new operating system, multi core processing and improved operator interface, as well as, optional upgrades for enhanced traceability. The iineo+ platform will be unveiled at the SMT Hybrid Packaging event.
Visitors to the exhibition will be the first in Europe to see the new placement machine, witness the new design and discover the productivity benefits on offer. iineo+ is designed to deliver a step change in value for production-wide management, process refinement and user accessibility.
The embedded component tester is the company’s Kelvin-connected electrical measuring system calibrated to all international standards. Manufacturers in demanding sectors like aerospace, medical, defence and automotive will welcome the optional Track Pack traceability upgrade. This takes 1D and 2D traceability to a new level by adding a suite of interoperable traceability and smart data analysis tools, including the company’s PROMON live production dashboard, to the test function. The Track Pack upgrade also includes an auto-width conveyor.
The company’s latest RC5.16 operating system software deploys multi core processing technology and client/server architecture to support an all-new graphical user interface, exploited through a large touch-screen monitor to drive productivity. The processing power behind RC5.16 boosts on-machine vision analysis processes and streamlines inter-platform communications – perfect for networked multi-machine production floors. iineo+ also introduces an enhanced Package Library, with new features that include the display of non-optimal package settings, exact shape representations for different device types, and a new special analysis mode for difficult devices.
SMT Hybrid Packaging, Booth 4-251
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