Indium Corporation will feature its void-reducing Indium 8.9HF solder paste to help customers “Avoid the Void” at IPC APEX Expo and at SMT Hybrid Packaging tradeshows. Indium8.9HF is a no-clean, halogen-free solder paste that delivers versatility and stability in the printing process.
Under optimal process conditions, Indium8.9HF:
- Demonstrates consistent printing performance for up to 12 months when refrigerated
- Maintains excellent printing and reflow performance after remaining at room temperature for one month
- Delivers excellent response-to-pause even after being left on the stencil for 60 hours
The industry-leading source of void-reducing materials and results, has specifically formulated solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. The solder paste delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects. The solder paste has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
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