Indium Corporation will feature its void-reducing Indium8.9HF solder paste to help customers “Avoid the Void” at SMT Hybrid Packaging May 16–18, in Nuremberg, Germany.
This solder paste is a no-clean, halogen-free that delivers versatility and stability in the printing process. Under optimal process conditions, Indium8.9HF:
- demonstrates consistent printing performance for up to 12 months when refrigerated.
- maintains excellent printing and reflow performance after remaining at room temperature for one month.
- delivers excellent response-to-pause even after being left on the stencil for 60 hours.
The company, the industry-leading source of void-reducing materials and performance, has specifically formulated Indium8.9HF solder paste to reduce voiding significantly below the industry average for improved finished goods reliability. This paste delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
It has a unique oxidation barrier technology that makes it perfectly suited for a variety of applications, especially automotive assembly.
SMT Hybrid Packaging, Booth 4–321