Nordson Dage, Nordson Matrix, and Nordson Yestech, divisions of Nordson Corporation, will exhibit their inspection systems and more in Booth #1510 and 1511 at the 2017 IPC APEX Expo, scheduled to take place from Feb. 14–16, 2017, at the San Diego Convention Center in California and will demonstrate test and inspection solutions.
Nordson Dage’s flagship system – the new Quadra 7 with 0.1 μm sub-micron feature recognition – comes equipped with two 4K UHD displays and 8 million pixels to fully show the 50 μm pixel pitch and 6.7 MP image size of the Aspire FP detector. The Quadra 5, with industry-leading core technology, offers high performance and ease of use for 2D and 3D X-ray applications. 0.35 μm feature recognition up to 10 W of power, makes the Quadra 5 the leading choice for printed circuit board and semiconductor package inspection systems.
The Matrix X3# is an automated inspection system designed for sophisticated high-speed inspection in SMT production. Transmission X-ray Technology with patented Slice-Filter-Technique (SFT), Off-Axis Technology, and 3D SART present a flexible solution package for the in-line inspection of single and double-sided PCB assemblies. The X3# movable detector axes allow high-speed off-axis image acquisition from different angles and directions with maximum image quality and resolution.
The Yestech FX-940 Ultra 3D AOI with 3D technology is ideal for the inspection of solder defects, lead defects/lifted leads, component presence and co-planarity of chips, BGAs and other height sensitive devices. With its Advanced Fusion Lighting and comprehensive inspection tools including angled cameras, full-color digital image processing and both image and rule-based algorithms, the system offers complete inspection coverage with unsurpassed 2D and 3D defect detection.
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