Homepage » Allgemein »

Compact solution with dual-track system for 3D AOI

Inspection of large circuit board
Compact solution with dual-track system for 3D AOI

Compact solution with dual-track system for 3D AOI
The design of the S3088 DT shows off its advantages particularly when space is tight in production. Source: Viscom AG

With the S3088 DT, Viscom AG has expanded its diverse range of inspection systems for the electronics industry to include an especially flexible, compact machine for dual-track operation. The new alternative to the S6056 will be on display at SMTconnect in Nuremberg, Germany.

The S3088 DT is configured as standard with a dual-track system for use in automatic optical inspection (3D AOI). Visitors to the show can experience the advantages of this solution in person at the company’s stand. The system features a unique combination of affordability, efficiency, speed and technical performance that meets all the requirements of large-scale mass production today, including, for instance, full connection to Industry 4.0 interfaces. It ensures reliable inspection of sophisticated 03015 components at an impressive throughput rate.

The system adapts to the varying track widths of the relevant production jobs and can also be used in single-track operation as required. The S3088 DT then offers the advantage, for example, of being able to inspect even the largest printed circuit boards.

Compared to the S6056 3D AOI system that many of the company’s customers use in a dual-track version, the S3088 DT is considerably more compact, particularly with regard to its width. Moreover, the monitor features a fold-out keyboard integrated in the door of the housing to save even more space – an innovative design solution that Viscom introduced in this system.

With regard to its sensor technology, the S3088 DT provides outstanding flexibility: in addition to its configuration for the most sophisticated 3D AOI tasks, configurations for solder paste inspection (3D SPI), conformal coating inspection (CCI) and underfill inspection (UFI) are also available.

SMTconnect, Booth 4A-120

www.viscom.com

Current Issue
Titelbild EPP EUROPE Electronics Production and Test 11
Issue
11.2023
READ
Newsletter

Subscribe to our newsletter now

Webinars & Webcasts

First hand technical knowledge

Whitepapers

Find all current Whitepapers here

Videos

Find all current videos here


Industrie.de Infoservice
Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:














Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.
AGB
datenschutz-online@konradin.de