Minimizing operator handling and removing stress on assembly Simultaneous bottom and top inline AOI solution with SQL database - EPP Europe

Minimizing operator handling and removing stress on assembly

Simultaneous bottom and top inline AOI solution with SQL database

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PowerSpector BTL AOI systems comes in two different models, either suitable for large or medium sized assemblies. Source: MEK Europe
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The Mek PowerSpector BTL AOI systems offer synchronized inspection of the top and bottom side of PCBs after reflow, wave or selective soldering and placement of SMT & THT components.

Patented synchronized lighting technology delivers new capabilities. 9 cameras per side, with both heads inspecting the PCB at the same time, deliver fastest inspection times but without the high power lighting system of each head affecting the other inspection taking place. The elimination of flipping removes potential for stress on the assembly and improves long term reliability of solder joints.

The GTAz based bottom side inspection head has a clearance of 30 mm from the PCB surface. An additional Z axis allows the head to be adjusted by 30 mm to allow optimal flexibility for inspection inside solder frames and the correct adjustment of side cameras to further enhance defect identification capabilities. The 18.75 µ resolution of the main optics and the 13 µ resolution of the side cameras also give the option for 01005 ” (0402 mm) SMD inspection including height verification of objects like pins and packages, as well as 3D chip height measurement.

The GDAz based top side inspection head combines a massive 60 mm top clearance with full solder joint inspection via the 3D meniscus profiler. An additional 30 mm Z-Axis, with an autofocus option, allows the user to focus on the top of taller components. The side cameras with 20 μ resolution can be used to inspect side markings on components as well as verify accurate insertion using height verification.

Operator misjudgements of found defects are minimized by the true 3D image defect display of 9-angle simultaneous microscopic views. Each defect is displayed with a magnification up to 50x (bottom up) or 30x (top down). This minimizes operator handling and reduces time spent on post-classification of defects using stationary microscopes

All images can be stored in the company’s Catch SQL database for review or post classification at any time after the actual inspection. For full tracking and tracing using your own MES system, the Catch system interfaces via its open SQL database or XML outputs.

The system is available in two different models; the PowerSpector 550BTL suitable for assemblies up to 5 kg with a maximum dimension of up to 550 x 550 mm (21.6 ”) and the PowerSpector 350BTL designed for medium size PCB’s up to 350 x 250 mm (13.8 “ x 9.8 “).

www.marantz-electronics.com

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