productronica 2019 Cluster structure

The cluster structure gives a comprehensive overview of the entire value chain of electronics manufacturing:

SMT Cluster (Halls A1, 2, 3, 4)

An important aspect of electronics production is surface-mount technology. This cluster includes:

• • Test and measurement technology, Quality assurance (A1, A2)
  • Component-mount technology (A2, A3)
  • Production logistics and material-flow technology (A2)
  • Soldering and joining technology for PCBs (A4)
  • Product finishing (A4)
  • Robots in electronics manufacturing (A3)

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Cables, Coils & Hybrids Cluster (Hall A5)

Production solutions for cables, connectors, wrapped goods are imperative for today’s innovations. This cluster covers:

• • Cable manufacturing
  • Manufacturing technologies for plug connectors
  • Coiled product manufacturing
  • Hybrid component manufacturing

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Semiconductors Cluster (Hall B2)

These segments are given much better visibility and importance. Topics covered are:

• • Semiconductor manufacturing
  • Manufacturing displays, LEDs and discrete components
  • Photovoltaics manufacturing
  • Micro-/nano-production
  • Cleanroom technology
  • Materials processing

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Future Markets Cluster (Hall B2)

Where is the market going? What trends and innovations can we expect? Topics include:

• • Industry 4.0
  • Smart Factory
  • 3D printing
  • IT to Production
  • Batteries and electrical energy storage
  • Additive manufacturing

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PCB & EMS Cluster (Hall B3)

Increasingly important role in the value chain, this cluster includes a marketplace, communication platforms, and covers the following topics:

• • PCB manufacturing
  • Circuit-carrier manufacturing
  • Electronic manufacturing services

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