Small electrical parts can cause a lot of damage. These parts can now be found in nearly every device, and not only are the amounts of parts increasing, but also at the same time miniaturizing, which raises the amount of potential failures in a device. Currently, applied packaging concepts on chip-to-chip or chip-to-wafer level are used commercially in products, such as smart phones, cameras, and laptops. Due to the increasing needs of electronic system manufacturers, an optimal combination of functionality, performance, reliability and price is requested. The geometric dimensions of the systems also play a decisive role.
For example, the dense construction on a board used in a smart- phone can lead to over 10.000 possible causes of malfunction– a risk for developers, as well as, decision makers, which could exceed the usual regulatory requirements of functionality and reliability. This development challenges external testing service providers – and engineers to choose state-of-the-art solutions in quality testing.
The causes of defects are diversified. Failures can lead to even bigger catastrophes, often combined with human failure or lack in quality. Especially in the process chain, where one part comes from another country or even continent, it is smarter for OEMs and designing engineers to think before taking action (by means of serial production).
Part of a damage investigation is to develop solutions and improvements for the production process, together with clients. The overall aim is to avoid future failures and to reduce the resulting warranty and maintenance costs. Today, damage analysis experience within companies (suppliers as well as manufacturers/constructors) is mostly insufficient, consequently external suppliers with specific knowledge are becoming more and more significant. Technical equipment and extensive know-how allow the investigation of faulty or suspect objects to be carried out efficiently and with high security of evidence. In addition, specialists are able to secure a critical chain of evidence through damage simulation.
TechnoLab GmbH is a service provider in the field of environmental simulation and damage analysis, with headquarters in Berlin operating globally across a variety of industries. The company offers material tests, quality inspections, certifications in accordance with current standards and, if required, develops individual solutions beyond standard dimensions. Damage analyses help developers optimize and secure their manufacturing process.
Main focus is on electronic assemblies: their use and process chain
The environmental simulation tests check the resistance of materials, individual components, assemblies, as well as entire devices and can be customized to meet individual requirements. It tests for any chemical-biological, physical or other effects, such as IP protection, temperature change, often combined with altitude/vacuum, vibration & shock, salt compatibility or solar radiation. In fields, such as chemical and biological resistance, noxious gas as well as blowing-sand, the company has unique capacities in Germany and Europe with an enlarged blowing-sand, even with a dust chamber with up to 25.000 liters volume. Mobile devices are also testable with a simulated speed of over 300 km/h.
Environmental simulations not just for serial production/ready-made products
The approach is to use a wide variety of test methods and to combine individual results in the analysis of damage in a technical failure case similar to the execution of a forensic investigation. Weaknesses are detected and documented by methods, such as optical inspection, metallographic preparation and material analysis. The company combines their expertise in environmental simulations with their failure analytic experience. The results of the investigation are presented as expert reports. It proves a legal safeguard in advance, and the test houses a broad portfolio of a possible recourse.
Application examples are:
Metallographic preparation
- Maximum micro section surface is 160 x 30 mm.
- Many failures as corrosive defects, e.g. caused by false storing, can be detected after a visual inspection of a metallographic preparation by microscope. Detecting weaknesses in converting or storing can provide groundbreaking insights for future processing or series production.
Light optical and scanning electron microscopy (SEM):
- Advantages: visibility of smallest structures.
- SEM inspection + analysis by means of energy or wavelength dispersive X-ray spectroscopy (EDX / WDX).
- For example, for bond connections: for a large number of microsystems, the bond connection is a significant influencing factor for its lifetime and thus the reliability of the systems. To ensure the functionality, therefore, an intensive analysis of the bonding interface or of the intermediate layer, as a function of the joining parameters, is required.
X-ray Fluorescence (RFA/XRF)
- Qualitative and quantitative determination of elementary composition and layer thickness determination.
Fourier-Transform Infrared Spectroscopy (FTIR)
- Identification of organic substances (polymers, adhesives, flux…).
- This method helps detecting materials which can also be responsible for system malfunction – since the complexity of information-, nano- and bio-technology on circuit boards makes it also more challenging to develop reliable sandwich systems in every detail.
With the move from Berlin-Tegel to Berlin-Siemensstadt, TechnoLab GmbH took a decisive step to meet the growing demands of their test environments and manufacturing processes for special test equipment and adaptors. The building, which has been restored by the company for this purpose, now offers more space with all the individual development options and maximum energy efficiency. The independent test laboratory for environmental simulation and failure analysis has over 22 years of experience and 1500 square meters of available test areas.
Zusammenfassung Résumé Zusammenfassung russisch
Ausfälle aufgrund fehlerhafter elektronischer Komponenten sind teuer, können aber durch eine Qualitätskontrolle so früh wie möglich im Produktionsprozess verhindert oder zumindest gemildert werden. Prüflabore gehen bei der Entwicklung ihrer Testsysteme einen Schritt weiter und bieten deutlich mehr als bisher übliche Tests an.
Les défaillances dues à des composants électroniques défectueux coutent chers, elles peuvent être évitées ou du moins atténuées par un contrôle de qualité se faisant le plus tôt possible dans le processus de production. Les laboratoires d‘essais vont plus loin dans le développement de leurs systèmes de test et offrent beaucoup plus que les tests habituels.
Отказы вследствие неисправных электронных компонентов обходятся дорого, но благодаря контролю качества их можно максимально рано предотвратить в производственном процессе, либо как минимум уменьшить их последствия. Испытательные лаборатории при разработке этих испытательных систем делают шаг вперед и предлагают значительно больше, чем распространенные ранее тесты.