Eliminating restrictive shapes of PCBs

Jet printing technology for miniaturizated products

Optomec Aerosol Jet 5X system can be used to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and more. Source: Optomec

Optomec, a supplier of production grade additive manufacturing systems for printed electronics, announced that Samsung Electronics has commissioned an Aerosol Jet 5X system in its printed electronics lab to enable next-generation electronics production.

Manufacturers value the Aerosol Jet‘s ability to print conductors and dielectric materials on 3D surfaces on many types of substrates. Electronics producers are now using the Aerosol Jet process to print RF interconnects, replace wire bonds in IC packaging, print antennas directly onto electronics enclosures and create multi-layer, miniature circuits — essentially eliminating the restrictive shapes of PCBs. These capabilities enable electronics designers to miniaturize products as well as change the form of the overall electronics package, allowing more organic and ergonomic designs.

The Optomec Aerosol Jet 5X system supports 5-axis of coordination motion with a 200 mm x 300 mm x 200 mm (x, y, z) print envelope and the ability to print features ranging from 10 microns to millimeters. In addition to the hardware and software of the Aerosol Jet System, the company provides two decades of materials and process research to match the performance and environmental requirements of the design to a proven production-ready process.



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