CyberOptics Corporation, a developer and manufacturer of high precision 3D sensing technology solutions, announces its next generation Airborne Particle Sensor technology (APS3) 300 mm with new ParticleSpectrum software.
The WaferSense APS3 speeds equipment set-up and long-term yields in semiconductor fabs by wirelessly detecting, identifying and monitoring airborne particles. Now in a thinner and lighter form factor to travel through semiconductor tools with ease, it offers leading accuracy and sensitivity valued by equipment and process engineers.
“Semiconductor fabs worldwide have adopted our Airborne Particle Sensors,” said Dr. Subodh Kulkarni, President and CEO. “We have further advanced the technology that they rely on to significantly improve their yields and tool uptime.”
This solution incorporates ParticleSpectrum software – a new, touch-enabled interface with user-friendly functionality, making it simple to read, record and review small to large airborne particle data and see the effects of cleanings, adjustments and repairs in real-time.
Also, the company’s 3D ultra high-resolution Multi-Reflection Suppression (MRS) sensor technology meticulously identifies and rejects reflections caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for highly accurate measurements. Offering an unmatched combination of accuracy and speed, MRS sensors are widely used for inspection and measurement in the SMT, metrology and in semiconductor markets. This technology, used in back-end inspection applications, is ideally suited for IC package, wafer bump inspection and mid-end semiconductor applications where the highest degree of precision is required.
