CCGA and PID vibration damping technology

Extending hardware life and reliability

CCGA and PID vibration damping technology

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The CCGA Column from TopLine reduces vibration and increases solder joint reliability. Source: TopLine
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TopLine’s CCGA Column Grid Array IC packages and Particle Impact Dampers (PID) that reduce random vibration will highlight the company’s exhibit at Apex Expo 2018 at the end of this month in San Diego. A PID informational video and demonstration will be held continuously in the company’s booth over the 3-day show.

In making the announcement, Martin Hart, President, stated, “We’re especially excited about the benefits of CCGAs, as well as new PID technology that reduces harmful vibrations and extends hardware life and reliability.”

The CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.

PID is a COTS commercially-available standard solution, suitable for retrofitting and hardening heritage hardware in the field. PIDs can be solder attached like ordinary components, or attached to the board using permanent epoxy adhesive. The series of Particle Impact Dampers were invented at NASA’s Marshall Space Flight Center.

Apex, Booth 3101

www.topline.tv

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