XJTAG, a supplier of boundary scan technology and Systech Europe, a European provider of electronic test solutions, announced the availability of an integrated solution using XJTAG boundary scan and Takaya’s flying probe system.
Based on strong customer demand the boundary scan technology supplier has worked with Takaya’s European distribution partner, Systech Europe, to create a powerful combination by integrating JTAG boundary scan with flying probe testing capabilities. With many devices now being manufactured in BGA or extremely fine pitched leaded packaging, the need to have boundary scan to control these devices is critical to achieving the best coverage. Furthermore, being able to use flying probes to reach parts of the circuit with no JTAG access allows boundary scan testing to achieve maximum coverage. The integration allows test engineers to shorten test cycle times at the same time as increasing test coverage.
Test cycle times are reduced by optimizing the number of probe movements carried out by the flying probe machine. Test coverage is increased by combining the physical access facilitated by the flying probes with the company’s ability to control the boundary scan technology built into many of today’s processors and FPGAs to control the signals on those devices.
As electronic circuits become more complicated the collaboration between leading suppliers is not only helping address the challenges facing engineers today but is also creating test solutions fit for the future.