Yamaha Motor Europe IM Division has shown how surface-mount assembly can continue to boost productivity and quality control, by introducing advanced equipment at SMT Hybrid Packaging in Nuremberg.
“The advantages of our total line solution concept now extend further across the factory than ever, with the latest machines for inline solder paste inspection and component storage and handling,” said Mr. Ichiro Arimoto, General Manager. “Visitors have been excited at the new opportunities we can offer to further raise productivity and quality, and reduce operating costs.”
Having promised to debut the YSi-SP solder-paste inspection (SPI) machine at the event, the company showed how high-speed 3D inline inspection boosts efficiency by coordinating with other machines, such as printing and placement. The YSi-SP consolidates multiple inspection modes, including high-precision with advanced algorithms, and super-high resolution, on one machine, with a single head, for maximum throughput and minimum operator workload. Augmenting the comprehensive standard features, options such as bonding inspection and foreign-matter inspection help customers target specific manufacturing challenges. The SPI machine also supports data-driven process improvement by capturing all pad images and measurements into Statistical Process Control (SPC) software.
The YST15 Intelligent SMD storage system also made its European debut. It integrates with the company’s Total Line Solution through Factory Tools software to bring new efficiencies to automated component storage, retrieval and delivery to the point of use. Storing up to 1500 reels, and able to load or unload up to 27 reels in one batch, it coordinates with events on SMT lines to extract the required devices from inventory in advance and ensure arrival at the right machine at the optimum time. It is also AGV-ready, to interact with automatic guided vehicles for component transportation in the factories of tomorrow.
Also new to European audiences, the ∑-G5S II mounter, which has maximum mounting speed which increased up to 20 %, to 90,000 cph, and features improvements to the rotary direct-drive head, streamlined board feeding, and a redesigned buffer for handling larger PCBs. Proven features of the the previous model are retained, including splice-free feeders, overdrive motion for front or rear component picking, and the efficient 1-head solution concept.
The YSM20R mounter was also displayed, which is the latest in the Z:LEX high-efficiency modular family. Higher mounting speed and a new wide-scan camera for components up to 12 mm x 12 mm with time-saving on-the-fly recognition give an extra boost to flexibility and throughput. Productivity can further be enhanced by choosing from options including the Auto-Loading Feeder (ALF), Auto Tray Sequencer (ATS) for non-stop tray replacement, and non-stop feeder-carriage exchange system.
Visible across the exhibition booth, and bringing all the machines in the line together, the company’s Factory Tools 4.0 software suite introduced new features including customizable machine-to-machine communications for Industry 4.0 in electronics-manufacturing enterprises. With new real-time performance and feeder-status monitoring, database-driven traceability, and powerful statistical process control (SPC) features, Factory Tools 4.0 comprises over 20 applications to streamline setup and programming, manage assembly throughput and productivity, and provide traceability down to each individual component and the nozzle that placed it.