Protecting enclosures against radiated interference and environmental elements

Form-in-place EMI shielding materials for the automotive industry

The FIP200 and FIP210 are designed for ease of dispensing small gasket beads and ideal for smart phones and automotive applications. Source: Electrolube

Electro-chemicals manufacturer, Electrolube, introduced a range of form-in-place EMI shielding materials and a silver conductive adhesive at this year’s SMT Hybrid Packaging show in Nuremberg. The products have proven extremely successful in China, where they have primarily been used for the smart phone market, and are now being launched to automotive manufacturers in Europe, who require reliable, high performance EMI shielding materials for applications such as automatic mirrors, cameras, radar modules, rear/side detection systems and car audio/entertainment systems.

The company’s form in place materials are dispensed onto metal, or conductive painted, plated, or metallic surfaces in the electronic enclosures to form an electromagnetic shield that is continuously conductive. FIP is suitable for applications that requires environmental sealing, has complex or rounded surfaces, or contains miniature devices requiring a precision gasket, thus protecting the enclosure against internally and externally radiated interference and environmental elements.

The FIP200 and FIP210 are single component moisture cure EMI shielding materials, designed to provide superior protection of electrical devices from electromagnetic interference in harsh environments. These environmentally friendly, low odor form-in-place materials are fast curing, flame retardant to UL94 V-0 and provide high dispensing performance. Both materials are designed for ease of dispensing small gasket beads (0.5 mm width by 0.4 mm height) and ideal for applications including smart phones and automotive.

FIP200 is a single component moisture cured material filled with traditional Ag/Cu particles. It offers low hardness, low closure force and superior electrically conductivity performance. FIP210 is also a single component moisture cured material filled with Ni/Cu particles. It offers high shielding effectiveness, low corrosion and low closure force. Superior performance in harsh environments makes this material an excellent choice for applications requiring long term reliability. Both materials have a tack free time of 5 minutes at 25 °C, 50 % higher RH with a maximum operating temperature of 125 °C.

The SCPE, a new generation silver conductive adhesive, also made its debut at the show, which has been specifically designed for LCD and LCM screens in cell phones and tablets. Suitable for high speed automatic dispensing, it is a fast curing adhesive that meets the demands for high throughput applications. The cured adhesive has excellent electrical conductivity and good adhesion to ITO screens. The silver conductive adhesive can be used to release static electricity from the polarizing film in LCM manufacture, and after heat and humidity testing, SCPE does not permeate through the polarizing film. With a wide operating temperature of – 50 to + 125 °C, it is a low viscosity, RoHS compliant adhesive, which provides a fast cure time of 10 minutes at 20 °C.

The company also launched silicone and polyurethane conformal coatings at the show, as well as encapsulation resins and thermal management materials.


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