Indium Corporation, materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has released m2TIM, a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.
This material combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.
Other benefits include:
- Availability in a variety of alloys, including InGa and InGaSn
- Extraordinary wetting ability to both metallic and non-metallic surfaces
- Extremely low interfacial resistance at surfaces
- Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms