Fast wetting and low spattering Improved no-clean, halogen-free flux-cored solder wire - EPP Europe

Fast wetting and low spattering

Improved no-clean, halogen-free flux-cored solder wire

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Nihon Superior Co. Ltd., a joining material supplier, has developed a flux-cored solder wire that greatly reduces spatter compared with conventional cored wire. The cored-flux, (032) allows the use of a wide range of soldering iron tip temperatures with very little spatter, even with high tip temperatures.

This solder wire is a general purpose, no-clean, halogen-free cored-flux. When paired with the SN100C lead-free alloy, it provides fast wetting and excellent solder joints, not only on copper (Cu) but also nickel (Ni) substrates. SN100C (032) is a good match for continuous robotic soldering due to the fast wetting and low spattering.

(032) cored-flux is available with the company’s SN100CV lead-free alloy that gains its strength from solute atoms in the tin matrix, as well as SAC305 solder.

Flux spattering test

The following were the test conditions:

  • Solder material: SN100C (032)
  • Supply quantity: 6.4 mm
  • Line diameter: 1.0 mm
  • Supply speed: 20 mm/second
  • Tip temperature: 350 °C, 380 °C, 410 °C

The test was conducted as a simulated „post soldering process“ which is performed as touch-up or repair of parts after initial soldering. Evaluation was conducted with solder tip temperatures of different temperatures.

www.nihonsuperior.co.jp

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