Inline concept for hot bar bonding and heat seal bonding systems

Flex-to-PCBs, flex-to-flex, flex-to-LCD, and wires-to-PCB

Inline concept for hot bar bonding and heat seal bonding systems

heat seal bonding
Nordson DIMA introduces inline concept for hot bar bonding and soldering at productronica 2017. Source: Nordson DIMA
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Nordson DIMA, a division of Nordson Corporation, exhibited a range of products at productronica. The company introduced its standardized automated inline concept for heat seal bonding, called the C-Quence, and included three unique modules for alignment, ACF laminating, and final bonding, but additional modules can be added for more process options. They also demonstrated its hot bar soldering and heat seal bonding desktop models and stand-alone systems, which are ideal for connecting flex-to-PCBs, flex-to-flex, flex-to-LCD, and wires-to-PCB in the electronics assembly industry.

In the European market, the company provides its customers with dispensing and coating products. Two new systems were at the show with their German distributor, AAT Aston. The Elite Coater offers more options to better use and maintain the coating system, including a new software option that makes it possible to remove the manual pressure regulator on the front of the machine. A demonstration of the Hybrid Dispenser will feature its new capability to handle an extra pick-and-place tool. Glue can be applied to the bottom piece, and the top piece can be placed and connected to it directly after the glue is dispensed.

www.nordsondima.com

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Save the date! 17. May 2018

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