Whether it’s the Connected Factory Exchange (CFX) showcase in cooperation with IPC, or the training of a collaborative robot, who then autonomously handles manual x-ray inspection, visitors to the Viscom stand at SMT Hybrid Packaging will gain insight into newest ideas of the industry being put into action. As an inspection solution with high future potential, the company will be exhibiting its X7056-II system: a combination of extremely fast inline X-ray inspection (3D AXI) and automatic optical inspection (3D AOI). Another future-oriented topic at the trade show will be artificial intelligence (AI).
As one of the highlights, the company will present the CFX Showcase in cooperation. In live demonstrations, standardized IoT data (Internet of Things) from 3D systems are displayed on mobile phones or tablets via the cloud. Analysis reports, system effectiveness overview and insight into the real data flow of SPI and AOI machines are easily accessible.
On the basis of intensive tests with the high-performance, collaborative robot Sawyer of the company Rethink Robotics, the company will show how the MXI system X8011-II PCB can be loaded and unloaded without human intervention. In electronics manufacturing, a robot like Sawyer is capable of handling tasks that require precision but repeat themselves monotonously. The operators are then available for more complex activities in the company.
Artificial intelligence is a topic that the company deals with from several perspectives: computer-based verification of defects for example already assists employees effectively and increases the overall process quality. The computational processes can be centralized for several lines and locations. As with automated and autonomous driving, there are various conceivable levels of independence from direct human influence in decision-making. The operator can be granted the right to edit only ambiguous cases. The compelling decision of a dedicated expert could also be included. All other standard verifications would be run without any human intervention. Deep learning will play an increasingly important role in the company’s program creation and component assignment (New Product Introduction – NPI). Components will therefore become more automatically recognizable.
Visitors to the show can get a firsthand look of the system performance that can integrate 3D AOI next to 3D AXI in the same machine housing. Equipped with xFastFlow, the company’s latest innovation for high-speed handling (board infeed and outfeed), the X7056-II can process three PCBs simultaneously. Handling time for inline X-ray inspection is reduced to less than four seconds.
SMT Hybrid Packaging, Booth 4A-122