Products for SMT assembly at productronica Latest stencils innovation and void reduction preform system - EPP Europe

Products for SMT assembly at productronica

Latest stencils innovation and void reduction preform system

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The company will present its latest stencils innovation. Source: Alpha Assembly Solutions
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Alpha Assembly Solutions, a leader in the production of electronic soldering and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the productronica exhibition in Munich, Germany from Tuesday 14th – Friday 17th November.

Alpha will present its latest stencils innovation, the Tensored Master Tensioning Frame at the show, which enables a higher and more even tension compared to company’s Tetra Frame. It is available in all common printer sizes, as well as configuration options for full 29” printer openings.

“Due to the innovative design of the Tensored, no air pressure on the frame is needed resulting in reduced maintenance costs and improved reliability,” explained Donald Corlett, Stencils Manager. “It also delivers several printing process benefits associated with higher tension, such as less paste smearing, reduced variation in and improved positional alignment on volume deposits”. (Compared to foil mounted in the Tetra Master Frame during standard print trial testing)

In addition, the company will showcase its newly developed solution for void reduction under bottom terminated components (BTC), the AccuFlux BTC-578 Preform System. The system combines the company’s AccuFlux BTC-578 preform, solder paste, engineered stencil designs and optimized processing parameters to dramatically and consistently decrease voiding.

productronica, Booth B3.272

www.alphaassembly.com

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