Nordson Dage, a division of Nordson Corporation, and a supplier of Bond Test and Materials Test equipment, announces the launch of Paragon Materials, a new suite of software designed for performing mechanical failure analysis on a range of micro-materials.
It is an exciting time to be in the micro-electronics industry as devices continue to become more complex and demands on their performance increase. Furthermore, expectations on product lifetime are as critical as ever, meaning new device evaluation needs to assess both long-term fatigue and cyclical performance. Adding to this complexity is the fact that failure can come from many different sources, including individual interconnects, surface components, the substrate material, or a combination of several of these sources.
Paragon Materials is specifically designed to tackle these complex failure modes and take the operator straight to the root cause of the failure mode. Traditionally, micro-materials testing has been difficult to set-up and even more taxing to extract the correct failure information from the raw data. The software presents a clear interface to the user featuring built-in analysis tools and statistical algorithms – allowing the user to find every failure with ease.
Alan King, Business Director, Bond Test and Materials Test commented, “Paragon Materials is a software platform focused on the mechanical testing and data analysis of materials used in conjunction with the packaging of complex electrical devices. Bond testing typically evaluates the integrity of interconnect associated with die and integrated circuits, essentially their connection to the outside world, however micro materials testing concentrates on evaluating the strength of the die and packaging itself.”
This second level of functionality is especially applicable to researchers when qualifying new materials and quality assurance when new products go into production. “Paragon” Materials software is a powerful addition to our already successful and established micro testing capability.”
