Metal ceramic substrate for the e-mobility industry

Primetime for power electronics

Metal ceramic substrate for the e-mobility industry

e-mobility
Layout by courtesy of Fraunhofer IISB. Source: Heraeus Electronics
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Heraeus Electronics, a provider of materials solutions for the semiconductor and electronic packaging industries, showcased the premium metal ceramic substrate Condura.prime (AMB-Si3N4), as well as, the associated substrate family Condura at PCIM trade fair in Nuremberg.

E-mobility drives demand for power electronic modules

Condura.prime is an active metal brazed silicon nitride substrate (Si3N4), which offers a variety of benefits compared to other metal ceramic substrates. It is vested with excellent mechanical properties ensuring high bending strength and high fracture toughness. Furthermore, Condura.prime offers outstanding thermal conductivity for heat dissipation and is therefore ideal for high-performance power electronic modules used in automotive, energy and traction applications.

Power electronic modules are in particular needed for the growing e-mobility market. With an increasing number of hybrid and electric vehicles, the industry is demanding efficient, economical, and reliable power electronic components. It is expected that demand for silicon nitride ceramic substrates with high reliability will increase in the future by expanded use in power semiconductor modules installed in electric drivetrains.

A family of metal ceramic substrates

The company also offers a comprehensive portfolio of metal ceramic substrates to optimally address customers’ requirements. The Condura family consists of the flagship product Condura.prime (AMB-Si3N4), Condura.extra (DCB-ZTA) with enhanced mechanical stability to improve module reliability and processability, as well as, Condura.classic (DCB-Al2O3), the proven standard for the power electronics industry.

Services beyond the product

To improve yield, lower production risks and to avoid cleaning steps, the company also introduced Condura Plus. Metal ceramic substrates can be equipped with pre-applied flux-free solder pads for die attach. This cuts the steps for die attach in half, simplifying the soldering process significantly.

The company also offers reliable IATF 16949 certified supply of the Condura portfolio. IATF 16949 is the technical specification introduced upon request by car manufacturers to build and certify a standard in the quality management system of suppliers. Engineering Services including simulation, prototype design and assembly as well as testing and analyses, makes the company the one-stop materials solutions partner for power electronics applications.

www.heraeus.com

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