Bonding wire for universities, labs, small-volume users

Bonding wire

Bonding wire for universities, labs, small-volume users

bonding wire
The new One Spool policy Source: TopLine Corporation
TopLine, a designer and manufacturer of semiconductor packages and PCB assemblies, has started a new service that makes it much easier for Universities, research facilities, laboratories, and small-volume users to obtain bonding wire manufactured by Tanaka. The company’s One Spool policy allows users to purchase as few as a single spool of bonding-wire. This policy is welcomed by customers who had been previously forced to purchase large lots of bonding-wire.
“Other manufacturers of bonding wire typically require customers to buy minimum order quantities, which might be 10 to 20 spools,” the President, Martin Hart, states. “But the company’s M.O.Q. is just One Spool. Our goal is to make it easy for small-volume customers to have quick, hassle-free access to Tanaka’s world -class quality bonding wire, helping Universities, laboratories and R&D projects helps to advance technology, and ultimately the industry that supports all of us,” he added. Examples of Tanaka bonding wire will be on display in the booth, # 923, at the IPC/APEX Expo 2017 trade show in San Diego, California, February 14–16, 2017.
Bonding wire is used in a wide range of applications, mostly involving wiring silicon die inside IC packages or bonding chips directly to PC boards, known as Chip on Board (C.o.B). The wire is also used to build prototype packages, as well as, small-scale production packages for today‘s North American market.
The company offers a full range of bonding wire in four alloys: Gold, Aluminum, Silver, and Copper, as well as, flat gold ribbon used in RF Microwave and certain segments of the solar industry. They also offer standard lengths on spools: 50m, 100m, 300m, 500m and 1000m, depending how much the customer needs on the spool. Wire is packaged on two-inch spools, as well as, half-inch spools for industry standard manual or automated bonding machines.

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