Indium Corporation will feature its reinforced solder alloy fabrications, InForms, on June 5–7 in Nuremberg, Germany at PCIM Europe. This show will simultaneously take place along with SMT Hybrid Packaging.
The company is redefining solder with its InForms solder preforms, as they are a composite preform consisting of solder with a reinforcing matrix. This combination increases lateral strength and improves bondline co-planarity, providing superior thermal cycling reliability.
These preforms do more than just bond two surfaces. They were designed to address some specific challenges to the power electronics industry. They provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
PCIM Europe, Booth 7–528
