Inspecting printing quality Solder paste inspection with M2M communication - EPP Europe

Inspecting printing quality

Solder paste inspection with M2M communication

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The 2D and 3D SPI machine offers volumetric measurement and has powerful process optimization capability. Source: Yamaha IM Division
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Yamaha Motor Corporation USA‘s Intelligent Machinery (IM) Division announces the launch of the YSi-SP, the first advanced 3D solder paste inspection (SPI) machine. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto a PCB, offering true volumetric measurement and powerful process optimization capability.

The YSi-SP performs high-speed, high-accuracy 2D and 3D solder paste inspection with a single head, employing image high-resolution switch-over for exceptional flexibility in a single machine.

The solution seamlessly communicates with other Yamaha machines to perform such Industry 4.0 tasks as automatic changeover, solder misalignment adjustment, and automatic conversion of glue inspection data from the dispenser. This is all possible due to the company’s expertise as a manufacturer of a full lineup of integrated SMT assembly equipment.

While offering a comprehensive Statistical Process Control (SPC) data package, the YSi-SP can also be equipped with various optional features including bonding and foreign matter inspection.

In making the announcement, George Babka, Sales General Manager, said, “The launch of the YSi-SP enables us to supply all of the primary machines required for mounting processes under the Yamaha brand. This includes printers, dispensers, solder paste inspection, surface mounters and automated optical inspection (AOI) systems. This enables our customers to build their production lines with the highest capabilities, efficiency, and quality.”

www.yamaha-motor-im.de/en

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