SPI dispenses solder paste for microchips

Identifying issues while eliminating repair costs

SPI dispenses solder paste for microchips

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Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has expanded its solution to perform complex dispensing.

Insufficient solder paste is a common defect in electronics assembly due in part to stencil design challenges stemming from component geometries and decreasing pad sizes. Increasing component density and tighter tolerances further complicate solder paste deposition. Insufficient solder can result in a weak solder joint, which will develop stress cracks on solder joints. The cost implications quickly accumulate, especially when multiple boards prototypes are manufactured in high volume. If defective, all the PCB must be cleaned, reprinted, or scrapped – all increasing production costs. Using the KY8030–3 SPI system to identify solder issues, and then dispense additional solder can eliminate these repair costs.

This system can perform the function of multiple machines. It becomes a dispensing solution when the Auto Repair feature is added; yet, it maintains its 3D SPI capabilities to accurately identify defects and root causes, especially when combined with powerful KSmart SPC features. An integrated dispenser within the inspection machine achieves micrometer precision and delivers dispensing capability for 0402M (01005) pads and larger. The company’s Auto Repair feature provides superior design benefits to maximize profitability and improve ROI.

Other highlights from the company are the 3D Zenith AOI, 3D Pin inspection (KY-P3), and 3D machining optical inspection (Infy). The KY-P3 delivers 3D inspection for various types of pin connections with unsurpassed accuracy. This latest innovative system provides fast inspection setting and modification based on quantified inspection results.

Additionally, the integrated KSmart solutions establish perfect data feedback using quality data. It is a measurement-based process analysis solution, which allows manufacturers to implement industry 4.0 with reliable full 3D measurement data. Further highlights that have particularly key features are the KSMART solutions like SPC@KSMART, Link@KSMART, OPO@KSMART (Offline Programming Optimizer), LM@KSMART (Library Manager), RTM@KSMART (Real-time Monitoring), and RMS@KSMART (Remote Monitoring System).

www.kohyoung.co.kr

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Titelbild EPP EUROPE Electronics Production and Test 11
Ausgabe
11.2018
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