Ultra-low voiding lead free solder paste for a variety of components

For high reliability applications: automotive and LED

Ultra-low voiding lead free solder paste for a variety of components

lead free solder paste
The Alpha OM-358 has consistent control of void distribution and resists to electrochemical migration on fine pitch component. Source: Alpha Assembly Solutions
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Alpha Assembly Solutions, producer of electronic soldering and bonding materials, has recently introduced Alpha OM-358, a zero-halogen, lead-free solder paste designed to provide ultra-low voiding performance on all component types, including bottom terminated components.

“Alpha OM-358 was designed to enhance process benefits through best-in-class voiding performance”, said Paul Salerno, Global Portfolio Manager for SMT Assembly for the company, a part of the MacDermid Performance Solutions Group of Businesses. “When using a high soak profile, it produces an average voiding of below 10%, with consistent control of void distribution for increased process stability, elimination of rework, and enhanced electrical and thermal performance of a customer’s end product”.

The lead-free solder paste exhibits excellent resistance to electrochemical migration on fine pitch components which makes it ideal for high reliability applications such as automotive (powertrain, in-cabin electronics & sensors), LED, medical and defense.

www.alphaassembly.com

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Titelbild EPP EUROPE Electronics Production and Test 11
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