Solderstar, a provider of profiling equipment for the electronic manufacturing industry, showcased its latest range of thermal profiling solutions at productronica 2017 exhibition.
Mark Stansfield commented: “It has been a busy year, with many new developments and improvements within our range of smart profiling solutions. Real-time monitoring of the thermal process has gained significant momentum with the drive towards smart manufacturing technologies, new emerging standards such as Hermes will further help with this goal and integration of information around the shop floor.”
“Our smart factory data capture system – ‘Smartline’ has undergone relentless development since its introduction at productronica 2015, we have continued to pioneer the use of web based technologies to help streamline and innovate the capture of real-time data from the soldering process. ‘Profile Central’ – our reflow soldering software suite has also benefited from some major development work, with many new features making this release. The new version now includes definition of individual process limits for each thermocouple measurement, allowing process windows to be tuned to the needs of specific/sensitive components. Advanced reporting functions have also been added to aid better sharing of information with both colleagues and customers.”
A complete range of equipment was demonstrated at the show, including the Pro range, which helps streamline the profiling operation for reflow ovens, wave/selective soldering machines, and the vapor phase process.
