Ten-layer high density interconnect board design capability

Stack up design with copper-filled laser-drilled micro-vias

Ten-layer high density interconnect board design capability

high density interconnect
Rush PCB Inc. manufactures multilayer High-Density Interconnect (HDI) PCBs of 10 layers and more. Source: Rush PCB Inc.

Rush PCB Inc., a printed circuit design, fabrication and assembly company located in the heart of Silicon Valley, offers capabilities in the design and manufacturing of multilayer High-Density Interconnect (HDI) PCBs of 10 layers and more.

In making the announcement, Akber Roy, CEO, stated, “To achieve very high-density interconnection, designers at Rush PCB Inc. use what we know as “Every Layer Interconnect” (ELIC) technology. This is a method wherein each layer has its own copper-filled laser-drilled micro-vias. When stacked up, it provides the opportunity for dynamic connections between any two layers in the PCB. Not only does this offer an increased level of flexibility, but it also maximizes circuit density.” Roy adds that the company’s designers have taken up the additional complex challenges in routing with Via-In-Pad (VIP) and by employing blind and buried vias. They laser-drill via holes and filled them with conductive copper paste.

Roy adds that “Before finalizing the design of multi-layer PCBs, our designers confirm the structure of the circuit board primarily based on the scale, physical size, and the requirements of electromagnetic compatibility (EMC). Our designers use 10 layers of material, and in this ‘Stack-Up Design’ have decided that the placement of the inner layer and the manner of distribution of different signals in these layers of the multi-layer PCB. This careful planning and determination of the stack-up design beforehand save the user much time and effort in wiring and production later.”

“Apart from very fine traces in the foil pattern, HDI requires Sequential Build-Up (SBU) and micro-vias drilled with lasers,” Roy says. “SBU technology is used to fabricate High-Density Interconnect boards. The HDI layers are usually built up from a traditionally manufactured double-sided core board or multilayer PCBs.”



Current Issue

Titelbild EPP EUROPE Electronics Production and Test 11


Here you can find all current videos

All Webinars & Webcasts

Here you can find all webinars from our industry pages

All Whitepaper

Here you can find all Whitepaper from our industry pages


Get the latest news from Electronics Production and Test! Subscribe now!


Industrie.de Infoservice

Vielen Dank für Ihre Bestellung!
Sie erhalten in Kürze eine Bestätigung per E-Mail.
Von Ihnen ausgesucht:
Weitere Informationen gewünscht?
Einfach neue Dokumente auswählen
und zuletzt Adresse eingeben.
Wie funktioniert der Industrie.de Infoservice?
Zur Hilfeseite »
Ihre Adresse:

Die Konradin Verlag Robert Kohlhammer GmbH erhebt, verarbeitet und nutzt die Daten, die der Nutzer bei der Registrierung zum Industrie.de Infoservice freiwillig zur Verfügung stellt, zum Zwecke der Erfüllung dieses Nutzungsverhältnisses. Der Nutzer erhält damit Zugang zu den Dokumenten des Industrie.de Infoservice.