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Discover smart technologies at SMT 2018

Placing its faith in perfect process efficiency
Discover smart technologies at SMT 2018

At this year’s SMT Hybrid Packaging in Nuremberg, the most important international specialist fair for system integration in microelectronics, system supplier Ersa is once again presenting innovative highlights for electronics manufacturing under the motto “Discover Smart Technologies”. The company’s developers and engineers have long raised their eyes from the individual product, setting their sights on optimum solutions for customer requirements or integration into digital systems.

Highest flexibility in selective soldering

One of the absolute highlights for innovative and efficient solution approaches is the Versaflex soldering module for the inline selective soldering platform, Versaflow 4/55. Two solder pots – installed independently on two axis systems and individually adjustable and controllable in x/y/z-direction – open up flexible dimensions in electronics manufacturing: whether completely independent soldering of PCBs or simultaneous soldering on multiple boards in x or y-direction, each combined with impressive cycle times. Today, the module is proving itself in real electronics manufacturing, confirming its pioneering technical position – for example at Siemens Austria or Kitron in Lithuania. As an intelligent addition, the intuitively-controllable CAD Assistant 4 (available for Smartflow 2020, Ecoselect 4, Versaflow 4/55 and 4 XL) provides fast offline programming with automatic cycle optimization – in parallel with the production of the machine, for constant, highest-level machine availability. Developed especially for “big boards”, the 4 XL machine offers the greatest versatility and highest soldering quality in PCB formats up to 610 x 1,200 mm.

Solutions oriented towards customer requirements

The company is also setting trends in the printer sector – with the Versaprint 2, which the next generation of its stencil printer will be presented. Intelligent features, such as an integrated 3D-SPI (Versaprint 2 Ultra3), a smart touch screen-user interface and “features on demand” are the basis for the highest cost effectiveness and flexibility.

With the Powerflow Pro N2, the company is launching its latest wave soldering system with two pots and databank-based Industry 4.0-capable user interface (Ersasoft 5). In the area of reflow soldering systems too, demand for longer machines which can deliver top temperature performance with low operating costs is rising – the answer is: Hotflow 4/26. With the HR 600 XL, an almost fully-automated hybrid rework system for XXL boards of up to 625 x 625 mm, the company rounds off the rework portfolio which started with its entry-level appliance HR 200, moved up to HR 550, and then on to HR 600/2.

At the SMT show, a cross section of an extensive portfolio will be shown, which illustrates its comprehensive process competence and permits the transfer of know-how in every direction. Not for the first time, the company is forgoing the physical presence of its high-performance soldering systems – the Smart Technologies are present in digital form, of course, and prove the ideal basis for discussions on all possible projects in the area of soldering. This dialogue is repeated time and again in the company’s application centers – customers from all over the world gets the opportunity to verify the desired results in a real production environment. The company‘s solutions and associated services are available worldwide and build on a future-proof Industry 4.0 basis.

SMT Hybrid Packaging, Booth 4–111

www.ersa.de

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Titelbild EPP EUROPE Electronics Production and Test 11
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11.2023
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