Device manufacturers ensure zero bond failure

Medical white paper

Device manufacturers ensure zero bond failure

bond failure
The recently released Whitepaper by Dymax Corporation discusses joint design considerations, bonds failures, using the right adhesive technology, and more. Source: Dymax Europe GmbH
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Dymax Corporation recently published a Whitepaper that outlines challenges facing medical device manufacturers that use hard-to-bond substrates and identifies how to overcome them.

Written by Michelle Gumbert and Patrick Vaugh, “Ensuring Adhesion on Medical Devices Made with Hard-to-Bond Plastic Substrates” white paper discusses how to overcome problems with adhesion of popular substrates in the medical device design like COC and PEBA. The paper was developed to help medical device manufacturers understand why bonds typically fail and how to design a process that will ensure a lasting bond leading to zero-failure.

Gumbert and Vaughn explore joint design considerations, the effect of sterilization methods, why bonds may fail, how to find the right adhesive technology, and how to inspect part to ensure that full cure has been achieved. A full copy of the white paper can be downloaded through this link.

www.dymax.com

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Save the date! 17. May 2018

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