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Novel solder alloy and minimizing QFN voiding in English and German

Experts to present at productronica 2017
Novel solder alloy and minimizing QFN voiding in English and German

Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria and Switzerland, and Karthik Vijay, Technical Manager, Europe, Africa and the Middle East, will present at productronica, November 14–17, in Munich, Germany.

Karch and Vijay will present the following:

A Novel Solder Alloy for Service Temperatures of 150–175°C in Automotive Applications

  • German presentation by Karch Wednesday, November 15 at 5 p.m.
  • English presentation by Vijay Thursday, November 16 at 5 p.m.

Minimizing QFN Voiding During SMT Assembly

  • German presentation by Karch Tuesday, November 14 at 4 p.m.
  • English presentation by Vijay Wednesday, November 15 at 4 p.m.

Karch provides technical support for customers in Germany, Austria and Switzerland, sharing process knowledge and making technical recommendations for the use of the company’s materials, such as solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Vijay is based in the UK and manages the company’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.

productronica, Booth A4.214

www.indium.com

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