Kyzen announced that it will reveal the latest research findings from controlled laboratory tests conducted in the interest of improving stencil printing reliability at SMT Hybrid Packaging 2018. The research indicates consistently lower production yields are delivered when some of the industry’s most common cleaning agents are utilized in under-stencil wipe applications. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs will also be shared at the show. The introduction video can be viewed here: www.kyzen-sneakpeek.com.
The evidence from this lengthy and objective study includes process videos and strongly supports the need for a wet wipe with an engineered solvent that matches to the flux composition. It concludes that reliable and acceptable assemblies start with a clean print. In addition, clean prints are more achievable on a reliable and repeatable basis with engineered solutions, such as Cybersolv C8882 than with standard IPA. In addition to sharing the results of the stencil reliability research findings, visitors to the stand can acquire custom technical support to help reduce misprints and increase production yields at no cost.
The company will feature the Cybersolv C8882, which is a fast-acting, stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process. The solvent dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents.
SMT Hybrid Packaging, Booth 4A-536