Indium Corporation has promoted Greg Evans to CEO, and Ross Berntson to President and COO. Former CEO and company owner William Macartney III will continue serving as the Chairman of the Board.
Evans has been with the company for 36 years, where he began as Technical Support Engineer and quickly rose to Product Line Manager, helping expand the product lines into the SMT assembly field. As Division Director for electronics assembly materials, he guided the growth of the solder paste product line and instituted a formal corporate R&D function.
Evans eventually became the VP of Manufacturing and Sales, overseeing the expansion of the company’s manufacturing footprint and sales structure in the UK, Singapore, China, South Korea, and Malaysia. He was named President and COO in 1997, leading the company’s growth from dozens of people to over 800 and from one factory in Utica, N.Y. to 12 facilities, worldwide. Evans earned his AAS in Engineering Science from Mohawk Valley Community College, his BS in Chemical Engineering from Clarkson University, and his MBA from Rensselaer Polytechnic Institute. As CEO, he will focus, primarily, on the company’s long-term mission and strategies, to ensure ongoing growth and vibrancy.
Berntson joined the company in 1996 as a product specialist. He quickly rose to the roles of product manager, marketing leader, sales leader, tech support leader, and, most recently, as Executive Vice President. Berntson is an active member of numerous industry organizations, including IPC, iNEMI, IMAPS, and SMTA. He has published several technical papers and articles, and presented at technical conferences globally. Berntson has a master’s degree in business administration and a bachelor’s degree in chemistry from Cornell University, where he earned the Henny Wittink Memorial Marketing Prize and the George Caldwell Award.
Indium Corporation is a materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil.